半導体製造装置都市市場調査レポート 2023-2035|規模, シェア, 分析, 用途, 販売, 成長洞察

According to our semiconductor manufacturing equipment market research, the front-end equipment segment in the market is expected to generate the largest revenue share by the end of 2035, holding a 41% share, due to high demand from manufacturing facilities. This helps expose critical layers of the wafer, thereby reducing the cost of manufacturing semiconductor devices. Additionally, major companies operating in the market along with several other regulators are funding the development of innovative front-end equipment.

By dimensions (2D, 2.5D, 3D)

The 3D segment is expected to hold a 46% share of the semiconductor manufacturing equipment market over the forecast period. The main reason for the segment size expansion is the increasing pressure on chip manufacturers to meet the rapidly increasing demand for chipsets, with IC manufacturers focusing on developing advanced chip packaging technologies such as 3D ICs. His 3D dimension of semiconductors is also well-suited to creating wafers that help manufacturers develop memory storage devices and reduce footprint.